电子科技大学学报2024，Vol.53Issue(6)：871-882,12.DOI:10.12178/1001-0548.2023266
射频微波功率放大器芯片技术研究进展及发展趋势
Research Progress and Development Trend of Radio Frequency/Microwave Power Amplifier Chip Technology
摘要
Abstract
Based on the comprehensive review and classification of the concepts,types,and realization processes of radio frequency/microwave power amplifier chips,this paper focus on the research status and urgent technical problems of key techniques such as high frequency,linearity improvement,energy conversion efficiency improvement,bandwidth expansion,highly integrated packaging and so on.The mainstream realization of each key technology,typical cases of research and development,as well as the advantages and disadvantages of the relevant applications,are also analyzed and discussed,targeting to summarize the methodology and provide design reference for the research and development of radio frequency front-end integrated power amplifier chips for modern wireless communication systems.Finally,the development trend and industry trend of radio frequency/microwave power amplifier chip technology are prospeted.关键词
射频微波/功率放大器芯片/高频化/效率提升/线性度改善/带宽扩展/高集成度封装Key words
radio frequency/microwave/power amplifier chip/high frequency/efficiency improvement/linearity improvement/bandwidth expansion/high integration packaging分类
电子信息工程引用本文复制引用
李镇兵,黄峻杰,张晋荣,贾世麟,付佳龙,吴祥睿,李钢,孙浩洋,文光俊..射频微波功率放大器芯片技术研究进展及发展趋势[J].电子科技大学学报,2024,53(6):871-882,12.基金项目
国家重点研发项目(2018AAA0103203) （2018AAA0103203）
四川省科技计划项目(2021YFH0133,2022YFG0230,2023YFG0040) （2021YFH0133,2022YFG0230,2023YFG0040）
中国移动研究院与X-NET联合项目(2022H002) （2022H002）
四川省智能终端重点实验室基金项目(SCITLAB-1015) （SCITLAB-1015）
