南京航空航天大学学报（英文版）2024，Vol.41Issue(5)：609-620,12.DOI:10.16356/j.1005-1120.2024.05.006
球栅阵列电子封装结构内部变形的非原位数字体图像相关方法研究
Ex-situ Measurement of Internal Deformation in Ball Grid Array Package with Digital Volume Correlation
王龙 1高子展 2张轩豪 2刘乔雨 1侯传涛 1邢睿思1
作者信息
- 1. 北京强度环境研究所可靠性与环境工程技术重点实验室,北京 100076,中国
- 2. 北京航空航天大学航空科学与工程学院强度与结构完整性全国重点实验室,北京 100191,中国
- 折叠
摘要
Abstract
In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.关键词
球栅阵列封装/数字体图像相关/离位/刚体位移/热循环测试Key words
ball grid array(BGA)packages/digital volume correlation/ex-situ/rigid body displacement/thermal cycling test分类
数理科学引用本文复制引用
王龙,高子展,张轩豪,刘乔雨,侯传涛,邢睿思..球栅阵列电子封装结构内部变形的非原位数字体图像相关方法研究[J].南京航空航天大学学报（英文版）,2024,41(5):609-620,12.
