辽宁工程技术大学学报（自然科学版）2024，Vol.43Issue(5)：618-624,7.DOI:10.11956/j.issn.1008-0562.20240206
Sn-Zn-Bi-Ga掺杂Ti纳米颗粒钎料制备及钎焊性能
Preparation and brazing properties of Sn-Zn-Bi-Ga doped nano-Ti particle solder
摘要
Abstract
Sn-5Zn-10Bi-0.5Ga+xTi(x=0.05%,0.1%,0.3%,0.5%,mass fraction)was prepared by doping nano-particle Ti into the Sn-Zn-Bi-Ga solder matrix.The wettability and oxidation resistance of the solder were analyzed,and the microstructure of the solder joint interface,the thickness characteristics of the intermetallic compound(IMC)layer and the mechanical properties were studied.The results show that the addition of nanoparticle Ti can improve the wettability and oxidation resistance of the solder,and can also improve the microstructure and mechanical properties at the interface.When the oxidation resistance of solder is the best,the mass ratio of oxidation weight gain tends to be stable and the growth rate is the lowest when the content of Ti nanoparticles is 0.3wt.%.Meanwhile,the maximum shear strength of the weldment is 32.10 MPa,when the mass fraction of Ti nanoparticles is 0.3%.关键词
Sn-Zn-Bi-Ga钎料/纳米颗粒/低温封装/金属间化合物扩散层/剪切强度Key words
Sn-Zn-Bi-Ga solder/nanoparticles/low temperature bonding/intermetallic compound diffusion layer/shearing strength分类
矿业与冶金引用本文复制引用
刘广柱,吕明垚,马志军,魏崇,吴佳美,王泽良..Sn-Zn-Bi-Ga掺杂Ti纳米颗粒钎料制备及钎焊性能[J].辽宁工程技术大学学报（自然科学版）,2024,43(5):618-624,7.基金项目
辽宁省教育厅基本科研项目面上项目(JYTMS20230811) （JYTMS20230811）
