集成电路与嵌入式系统2024，Vol.24Issue(12)：66-70,5.DOI:10.20193/j.ices2097-4191.2024.0042
基于有限元仿真的航天器用高密度封装键合丝结构设计约束探究
Research on design constraints of high density package bonding wires for spacecraft based on finite element simulation
李培蕾 1张伟 1姜贸公1
作者信息
- 1. 中国航天宇航元器件工程中心,北京 100094
- 折叠
摘要
Abstract
This paper analyzes the failure phenomenon of a high-density packaged product for spacecraft under random vibration in the aerospace environment.Based on the structural model and application conditions of this product,a finite element simulation model is es-tablished.The results of simulation and failure analysis indicate that the device breaking bond wire under vibration loads undergo fatigue damage and instantaneous fracture in two steps,causing device failure.Based on this analysis,models with different bond wire lengths were established and simulated under random vibration conditions of spacecraft.关键词
高密度封装/随机振动/失效分析/有限元仿真Key words
high-density packaging/random vibration/failure analysis/finite element simulation分类
信息技术与安全科学引用本文复制引用
李培蕾,张伟,姜贸公..基于有限元仿真的航天器用高密度封装键合丝结构设计约束探究[J].集成电路与嵌入式系统,2024,24(12):66-70,5.
