有色金属材料与工程2024，Vol.45Issue(6)：86-93,8.DOI:10.13258/j.cnki.nmme.20240127001
氢化膜对钛表面电镀镀层结合的影响
Effect of hydrogenation films on the bonding of electroplating coatings on titanium surface
摘要
Abstract
The effect of hydrogenated film on the bonding of titanium surface electroplating layer was investigated by scanning electron microscope(SEM),X-ray diffractometer(XRD)and energy dispersive spectrometer(EDS).The experimental results show that titanium hydrogenated with a mixture of hydrochloric acid and sulfuric acid,on the one hand,can realize nickel-copper plating on titanium substrate,which improves the bonding strength of the plating layer,and the maximum bonding strength of the plating layer is 9.6 MPa;however,on the other hand,the formation of honeycomb-like porous hydrogenated film can limit the bonding strength of the plating layer.The porous hydrogenated film not only causes a hollow and porous plating layer,but also stops the removal of the impurities generated by hydrogenation from the holes,furthermore,the porous hydrogenated film is not strong,and all these factors affect the bonding between the plating layer and the substrate,which limits the improvement of the bonding strength of the plating layer to some extent.关键词
钛/电镀/氢化膜/镀层结合强度/中空镀层Key words
titanium/electroplating/hydrogenated film/bonding strength of the plating layer/hollow plateing layer分类
化学化工引用本文复制引用
宗豪,刘新宽,刘实..氢化膜对钛表面电镀镀层结合的影响[J].有色金属材料与工程,2024,45(6):86-93,8.基金项目
国家自然科学基金资助项目(51771119) （51771119）
