华中科技大学学报（自然科学版）2024，Vol.52Issue(12)：1-20,20.DOI:10.13245/j.hust.241201
陶瓷转接板制备技术与应用进展
Progress in preparation technology and application of through ceramic via interposer
摘要
Abstract
With the increase in chip power and package integration,the reliability issues of devices caused by heat accumulation become much more severe.The package substrate is the critical material for chip support,protection,electrical interconnection and heat dissipation,which directly affects the performance and reliability of the device.Through ceramic via(TCV)interposer is a kind of ceramic substrate with redistribution layers and vertical interconnections,which has the advantages of excellent heat conductivity,satisfactory heat resistance,high circuit accuracy,the ability to interconnect vertically,and could meet the needs of miniaturization,integration,and high reliability of power device packaging.Through ceramic via interposer has been widely used in semiconductor lighting(white lighting emitting diode,white LED),sterilization and disinfection(ultraviolet-LED),laser and optical communication,power electronics,high-temperature sensing,thermoelectric cooling,microwave,radio frequency,and other fields,which plays an essential role in advanced packaging.To prepare a high-performance through ceramic via interposer,it is necessary to solve the key technologies such as ceramic via laser processing,defect-free via filling,high-speed and low-stress thick copper pattern plating,and copper surface grinding.The development history of the through ceramic via interposer was introduced first,then the key preparation technology was analyzed,and the application of through ceramic via interposer was finally summarized.关键词
陶瓷转接板(TCV)/激光打孔/电镀填孔/高速电镀/先进封装/功率半导体/三维集成Key words
through ceramic via(TCV)interposer/laser drilling/through-hole filling/high-speed electroplating/advanced packaging/power semiconductor/three-dimensional integration分类
信息技术与安全科学引用本文复制引用
王卿,王莎鸥,彭洋,刘松坡,陈明祥..陶瓷转接板制备技术与应用进展[J].华中科技大学学报（自然科学版）,2024,52(12):1-20,20.基金项目
国家自然科学基金资助项目(62274069). （62274069）
