新型炭材料（中英文）2024，Vol.39Issue(5)：844-871,28.DOI:10.1016/S1872-5805(24)60887-5
三维碳基导热网络的设计、进展和挑战
Design,progress and challenges of 3D carbon-based thermally conductive networks
摘要
Abstract
The advent of the 5G era has stimulated the rapid development of high power electronics with dense integration.Three-dimensional(3D)thermally conductive networks,possessing high thermal and electrical conductivities and many different structures,are regarded as key materials to improve the performance of electronic devices.We provide a critical overview of carbon-based 3D thermally conductive networks,emphasizing their preparation-structure-property relationships and their applications in dif-ferent scenarios.A detailed discussion of the microscopic principles of thermal conductivity is provided,which is crucial for increas-ing it.This is followed by an in-depth account of the construction of 3D networks using different carbon materials,such as graphene,carbon foam,and carbon nanotubes.Techniques for the assembly of two-dimensional graphene into 3D networks and their effects on thermal conductivity are emphasized.Finally,the existing challenges and future prospects for 3D carbon-based thermally conductive networks are discussed.关键词
炭材料/三维网络/石墨烯/导热率/热传输Key words
Carbon material/3D network/Graphene/Thermal conductivity/Heat transfer分类
化学化工引用本文复制引用
井源,刘汉卿,周锋,戴昉纳,吴忠帅..三维碳基导热网络的设计、进展和挑战[J].新型炭材料（中英文）,2024,39(5):844-871,28.基金项目
National Key R&D Pro-gram of China(2023YFB4005204),National Natural Science Foundation of China(22125903,22379144,22109160,22279137,22109040,22138013),Liaon-ing Province Applied Basic Research Program(2023020164-JH2/1013),Dalian Institute of Chemic-al Physics,Chinese Academy of Sciences(DICP I202313,DICP I202324).. 国家重点研发计划项目(2023YFB4005204) （2023YFB4005204）
国家自然科学基金项目(22125903、22379144、22109160、22279137、22109040、22138013) （22125903、22379144、22109160、22279137、22109040、22138013）
辽宁省应用基础研究计划项目(2023020164-jh22/1013) （2023020164-jh22/1013）
中国科学院大连化学物理研究所(DICP I202313、DICP I202324). （DICP I202313、DICP I202324）
