复合材料科学与工程Issue(12)：49-53,61,6.DOI:10.19936/j.cnki.2096-8000.20241228.007
热熔法预浸料用双酚M氰酸酯树脂的制备及性能研究
Preparation and properties of bisphenol M cyanate ester resin for hot melt prepreg
摘要
Abstract
In this paper,CM01 resin for hot melt prepreg was prepared by using bisphenol M cyanate ester res-in as raw material,and employing the method of cyanate ester monomer pre-polymerization which is then catalysted by copper acetylacetonate and nonylphenol.The processability of the resin and the dielectric,hygroscopic,thermo-mechanical and mechanical properties of the cured resin were investigated.The properties of CM01 resin were com-pared with the ones of CA01 resin which was prepared by bisphenol A cyanate under the same conditions.The re-sults show that CM01 resin has good processing fluidity,which is suitable for hot melt prepreg preparation.Prepregs prepared by CM01 resin have a wide window for high temperature pressing,thus suitable for composite molding.The cured CM01 resin has excellent dielectric and hygroscopic properties.The dielectric constant and dielectric dissipa-tion factor of cured CM01 resin are 2.78～2.80 and 0.004 53～0.005 11 respectively in the frequency range of 7～15 GHz,while those of cured CA01 resin are 2.99～3.01 and 0.010 8～0.012 3 respectively.The saturated water absorption of cured CM01 resin is 0.85%,which is 60%lower than that of cured CA01 resin.The cured CM01 res-in has good heat resistance and mechanical properties,the glass transition temperature Tg is 198.1℃,the tensile strength and tensile modulus are 66.51 MPa and 3.06 GPa respectively,the elongation at break is 2.39%,the flexural strength and flexural modulus are 134.45 MPa and 3.09 GPa respectively.关键词
双酚M氰酸酯树脂/双酚A氰酸酯树脂/热熔法预浸料/介电/吸湿/复合材料Key words
bisphenol M cyanate ester/bisphenol A cyanate ester/hot melt prepreg/dielectric properties/wa-ter absorption/composites分类
通用工业技术引用本文复制引用
姚卓君,郝尚,李钱福,杨征强,张砚达,刘千立..热熔法预浸料用双酚M氰酸酯树脂的制备及性能研究[J].复合材料科学与工程,2024,(12):49-53,61,6.基金项目
运载火箭用全国产化碳纤维复合材料耐超低温燃料贮箱的制备与性能评价(22511102701) （22511102701）
