集成电路与嵌入式系统2025，Vol.25Issue(1)：34-39,6.DOI:10.20193/j.ices2097-4191.2024.0072
射频电路封装设计与工艺实现方法研究
Research on design and process of electrical packaging for RF circuit
苏德志 1王岑 1詹兴龙1
作者信息
- 1. 山东航天电子技术研究所,烟台 264000
- 折叠
摘要
Abstract
Communication technology is closely related to social development.The realization of RF circuit had promoted the level of communication technology,and had become one of the hot spots of RF circuit.The difference between RF circuit and digital circuit re-flected in the packaging technology.This paper took packaging design and process as the title,and introduced the development status,technical requirements and process route of RF circuit.Electrical packaging consisted of basic principle,packaging design and implemen-tation,which had guiding significance for RF circuit packaging.关键词
无线通信/射频电路/封装工艺/键合工艺Key words
wireless communication/RF circuit/electrical packaging/bonding process分类
电子信息工程引用本文复制引用
苏德志,王岑,詹兴龙..射频电路封装设计与工艺实现方法研究[J].集成电路与嵌入式系统,2025,25(1):34-39,6.
