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面向超高频植入式RFID芯片的温度传感器研制

王俊杰 肖宛昂 吴静珠

集成电路与嵌入式系统2025,Vol.25Issue(1):47-55,9.
集成电路与嵌入式系统2025,Vol.25Issue(1):47-55,9.DOI:10.20193/j.ices2097-4191.2024.0053

面向超高频植入式RFID芯片的温度传感器研制

Development of temperature sensor for UHF implantable RFID chips

王俊杰 1肖宛昂 2吴静珠1

作者信息

  • 1. 北京工商大学计算机与人工智能学院,北京 100048
  • 2. 中国科学院半导体研究所人工智能与高速电路实验室,北京 100083||中国科学院大学集成电路学院,北京 100049
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摘要

Abstract

In this work,a temperature sensor designed for UHF implantable RFID chips is implemented using a 0.18 μm process.The sensor employs MOS transistors as the temperature-sensing elements,with the core design based on a low-power temperature sensing circuit using subthreshold MOS transistors.The sensor utilizes Proportional To Absolute Temperature(PTAT)and Complementary To Absolute Temperature(CTAT)voltage delay generators to form a pulse width generation circuit,which produces pulse width signals that are quantified by a Time-to-Digital Converter(TDC).The core circuit layout area is 298 μm ×261 μm,with a temperature meas-urement range of 35~45℃.Tape-out testing results indicated that,after two-point calibration,the maximum temperature measure-ment error across three chips was±0.4 ℃,with a maximum error of±0.2 ℃ in critical temperature ranges.The measured power consumption was 623 nW.Based on the tape-out results,the current chip's limitations were identified,and directions for future chip structure iterations were proposed.

关键词

RFID芯片/温度传感器/TDC/亚阈值

Key words

RFID chip/temperature sensor/TDC/subthreshold

分类

电子信息工程

引用本文复制引用

王俊杰,肖宛昂,吴静珠..面向超高频植入式RFID芯片的温度传感器研制[J].集成电路与嵌入式系统,2025,25(1):47-55,9.

基金项目

国家自然科学基金(61807001). (61807001)

集成电路与嵌入式系统

1009-623X

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