测试技术学报2025，Vol.39Issue(1)：27-32,95,7.DOI:10.62756/csjs.1671-7449.2025005
封装黏合材料对高温压力传感器性能影响研究
Effect Study of Encapsulating Adhesive Materials on the Performance of High-Temperature Pressure Sensors
摘要
Abstract
The packaging structure of SOI high-temperature pressure sensors is an important factor affecting its stable operation in high-temperature environments.In this paper,based on an SOI chip,inorganic high-emperature adhesive,epoxy resin and glass paste were used as packaging and bonding materials,and three high-temperature pressure sensors were prepared from each material.After a 300℃@100 h online test,the results showed that the average zero output drift of the high-temperature pressure sensor prepared by inorganic high-temperature adhesive,epoxy resin and glass paste was about 0.019 05,1.649 65 and 0.066 93 mV/h,within 300℃@100 h,respectively.The average integrated repeatability,hysteresis and linearity were 1.062%,4.932%and 1.857%,respectively.The experimental results show that the smaller the coefficient of thermal expansion,the smaller the influence on the output performance of the sensor at high temperatures.关键词
SOI高温压力传感器/封装黏合材料/热膨胀系数Key words
SOI high-temperature pressure sensor/encapsulation bonding material/coefficient of thermal expansion分类
计算机与自动化引用本文复制引用
罗后明,雷程,李锐锐,张姝,赵佳龙,肖楚译,王旦旦..封装黏合材料对高温压力传感器性能影响研究[J].测试技术学报,2025,39(1):27-32,95,7.基金项目
国家重点研发计划资助项目(2023YFB3208500) （2023YFB3208500）
中央引导地方科技发展资金项目(YDZJSX20231B006) （YDZJSX20231B006）
