铜业工程Issue(6)：90-100,11.DOI:10.3969/j.issn.1009-3842.2024.06.011
铜合金板坯孔洞类缺陷的超声波检测研究
Ultrasonic Detection of Cavity Defects in Copper Alloy Slab
摘要
Abstract
Copper and copper alloy are important metal materials in modern human life,which are widely used in communication elec-tronics,rail transit,heat dissipation and refrigeration industries.Copper and copper alloy initial casting blanks often have internal de-fects such as holes,inclusions,porosity and cracks in industrial production,which seriously affect the subsequent processing and prod-uct quality.The traditional manual inspection method has low efficiency,poor accuracy,and can not judge the internal defects of billet.In this paper,the ultrasonic detection technology is applied to determine the internal cavity defects of copper alloy continuous casting plate.The response of ultrasonic detection to different types of cavity defects is studied by means of experiment and simulation,and the cavity defects are standardized and quantified by C-scan imaging technology.The results show that two kinds of prefabricated hole de-fects can be detected by adjusting the structure and parameters of ultrasonic testing equipment,and the optimal gain range of Φ1.2 mm flat hole defect and Φ0.8 mm straight hole defect is 53～56 dB.Ultrasonic propagation in flat bottom holes with different diameters and side straight holes with different depths can be simulated by using multi-physics simulation software.Compared with A-scan pulse re-flection waveform after ultrasonic interaction with defects,the theoretical calculated value of ultrasonic propagation to the upper surface of defects differs by 3%and 6%respectively from experiment and simulation,which verifies the accuracy of simulation model.关键词
铜合金/水平连铸/超声波检测/孔洞缺陷/多物理场模拟仿真Key words
copper alloy/horizontal continuous casting/ultrasonic detection/hole defect/multi-physics simulation分类
机械制造引用本文复制引用
梁海成,刘明华,宫赫庭,陈大勇,王松伟,刘欢,胡凯,刘劲松..铜合金板坯孔洞类缺陷的超声波检测研究[J].铜业工程,2024,(6):90-100,11.基金项目
辽宁省教育厅基本科研项目(LJKMZ20220591) （LJKMZ20220591）
中国科学院国际伙伴计划项目(172GJHZ2022054GC)资助 （172GJHZ2022054GC）
