集成技术2025，Vol.14Issue(1)：91-104,14.DOI:10.12146/j.issn.2095-3135.20240119001
基于积层胶膜材料封装基板的信号损耗研究
Study on Signal Loss of Packaging Substrate Based on Build-Up Film Material
摘要
Abstract
Against the backdrop of Moore's Law approaching its limits and the increasing difficulty and cost of next-generation integrated circuit technologies,advanced substrate technology emerges a crucial carrier for supporting I/O enhancementand system integration in the realm of advanced packaging.It is also one of the core components in the post-Moore era.Currently,semi-additive process utilizing build-up film(BF)is one of theprimary methods for achieving fine-pitch multilayer packaging substrates.Given the increasingly prominent issue of signal integrity in electronic equipment operating in high-frequency and high-speed environments,this paper thoroughly discusses the impact of the physical properties of BF material and structural characteristics on signal transmission loss.Based on typical substrate structures,such as microstrip lines and vias,the relationship between BF material parameters and signal transmission performance is studied using an electrical simulation analysis system.It is found that in a microstrip structure,the signal transmission loss increases with an increase in frequency,and this loss is closely related to the dielectric loss factor of BF material.However,in the via structure,the dielectric constant of the BF material significantly influences the equivalent capacitance and the value of impedance,subsequently affecting impedance mismatch.Although the characteristics of the BF material do have some impact on impedance mismatch,the primary factor affecting impedance matching remains the design of via structure itself.In addition,the conductor loss resulting from the skin effect increases with the rise in copper foil roughness at high frequency,offering a crucial reference for quality control of copper foil during the manufacturing process of packaging substrate.This study elucidates the mechanism of physical property and structural characteristics of BF material influencing signal transmission loss,thereby proving a theoretical foundation for the design and optimization of BF material with enhanced physical properties for packaging substrate.关键词
积层胶膜材料/封装基板/微带传输线/过孔/传输损耗/电磁仿真Key words
build-up film material/packaging substrate/microstrip line/vias/transmission loss/electromagnetic simulation分类
信息技术与安全科学引用本文复制引用
孔维坤,钟诚,陈文博,于淑会,孙蓉..基于积层胶膜材料封装基板的信号损耗研究[J].集成技术,2025,14(1):91-104,14.基金项目
国家自然科学基金项目(U20A20255) （U20A20255）
深圳市科技计划项目(JSGG20210629144805017) This work is supported by National Natural Science Foundation of China(U20A20255)and Shenzhen Science and Technology Program(JSGG20210629144805017) （JSGG20210629144805017）
