航空科学技术2025，Vol.36Issue(1)：95-102,8.DOI:10.19452/j.issn1007-5453.2025.01.011
MEMS加速度计硅摆微区感应加热键合技术研究
Research on MEMS Accelerometer Silicon Pendulum Micro-zone Induction Heating Bonding Technology
摘要
Abstract
High-precision micro-electro-mechanical system(MEMS)navigation devices,such as micro-machined gyroscopes and photoelectric accelerometers,play a very important role in various fields including aerospace due to their advantages of miniaturization,intelligence,high integration and capabilities of large-scale manufacturing.The pendulosity of the photoelectric accelerometer has a great influence on the system characteristics(such as static bias and scale factor)and even the overall dynamic performance of the system.Aiming at the problems of static deviation and temperature hysteresis caused by adhesive bonding deformation and material mismatch imbalance in silicon pendulum in photoelectric accelerometer,this paper proposes a micro-area induction heating bonding technology using low-temperature metal solder instead of traditional adhesive bonding to realize low-temperature and high-strength bonding between silicon pendulum and substrate,and overcome the defects of creep hysteresis and connection instability introduced by adhesive bonding.At the same time,the scale effect behavior of micro-area induction heating technology was studied,the structural design and manufacturing process of the bonding layer were clarified,and the influence of bonding process parameters on the solder reflow temperature was also investigated.The bonding test results show that the bonding strength between the silicon pendulum and the substrate is greater than 12 MPa,which greatly improves the stability of the silicon pendulum connection,lays a foundation for the high reliability and stable operation of the accelerometer silicon pendulum,and improves the accuracy and working life of the aerospace inertial navigation and inertial guidance systems.关键词
微区感应加热键合/加速度计/连接稳定性/键合工艺Key words
micro-zone induction heating bonding/accelerometer/connection stability/bonding technology分类
航空航天引用本文复制引用
刘鑫,张依依,陈卓,陈亮,叶坤,王凌云,吴德志..MEMS加速度计硅摆微区感应加热键合技术研究[J].航空科学技术,2025,36(1):95-102,8.基金项目
国家自然科学基金(52075464) （52075464）
航空科学基金(20180868002) National Natural Science Foundation of China(52075464) （20180868002）
Aeronautical Science Foundation of China(20180868002) （20180868002）
