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高密度集成收发组件热电协同设计OA

Thermal-electric co-design of high density integrated transmitter and receiver components

中文摘要英文摘要

近年来,有源相控阵雷达在尺寸、质量和功率密度等方面的要求越来越高,收发组件的体积、功率、散热等面临更大的挑战.本文提出一种高密度集成收发组件热电协同设计方案,设计出一款高导热、高输出功率、高集成度的系统级封装,实现了收发组件的收发前端功能,并在组件中验证了其性能.

In recent years,active phased array radar has imposed increasingly demanding requirements in aspects such as size,weight,and power density,presenting considerable challenges to the volume,power,and heat dissipation of the transmitter and receiver components.This paper proposes a thermal-electric co-design scheme for high density integrated transmitter and receiver components and designs a system in package with high efficiency heat dissipation,high output power,and high integration to achieve the transmitter and receiver front-end functions of the components which has been verified in the components.

朱啸宇;李伟;胡梦婕

中国电子设备研究所,南京 210007中国电子设备研究所,南京 210007中国电子设备研究所,南京 210007

收发组件热电协同设计高导热高集成度系统级封装(SIP)

transmitter and receiver componentsthermal-electric co-designhigh efficiency heat dissipationhigh integrationsystem in package(SIP)

《电气技术》 2025 (2)

75-80,6

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