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耐高温含氢乙烯基有机硅树脂的合成及改性OA北大核心

Synthesis and modification of high-temperature hydrogen-containing vinyl silicone resins

中文摘要英文摘要

随着国防工业、电子信息工业以及航空航天等领域的快速发展,对性能优异的耐高温材料的需求不断增加.以含有硅-氢键和硅-乙烯键的烷氧基硅烷为原料,采用简单的两步法在酸性条件下成功制备出了热稳定性较好的含氢乙烯基有机硅树脂.研究了改性有机硅树脂的合成条件,通过红外光谱和热重分析仪表征了其化学结构和热稳定性,并采用热重-红外光谱联用分析了其热解机理.结果显示,三乙氧基硅烷和乙烯基三乙氧基硅烷以摩尔比5/1投料,控制盐酸水溶液的pH值为1、水解温度为30℃、水解时间为3 h制备的有机硅树脂在800℃下残炭率达到97.84%,远高于一般有机硅树脂的耐高温性能.对有机硅树脂的热解机理分析表明,含氢乙烯基有机硅树脂主要经历两个热分解阶段:首先是253℃左右的由有机硅树脂侧链连接部分引起的乙烯基氧化降解;其次是578℃左右有机硅树脂末端的硅羟基回咬导致有机硅树脂骨架的随机断裂和重排.

Silicone resin is a type of high-temperature-resistant material with excellent properties and exhibit broad application prospects in the field of heat resistance.With a rapid development of silicone resin for thermal protection coating in the na-tional defense industry,it is difficult to meet the current requirement of applications.Therefore,there is a great strategic val-ue to improve the high temperature resistance of silicone resin.Thermally stable vinyl silicone resin containing hydrogen was successfully prepared by a simple two-step method under acidic conditions using the alkoxysilanes containing silicon-hydro-gen and silicon-ethylene bonds as raw materials.The synthesis conditions of the modified silicone resin were investigated by infrared spectroscopy and thermogravimetry analysis,and its chemical structure,thermal stability,and thermal decomposi-tion mechanism by thermogravimetric Fourier transform infrared analysis.The results indicated that the synthesis conditions were determined to be a pH of 1.0,a hydrolysis temperature of 30℃,and a hydrolysis time of 3 h by using triethoxysilane and vinyl triethoxysilane as monomers and ethanol and hydrochloric acid as organic solvents.The as-synthesized silicone res-in obtained a char yield of 97.84%at 800℃when synthesized under the optimum conditions,and its high temperature resis-tance was far higher than that of the ordinary silicone resin.The thermal decomposition of the hydrogen-containing vinyl sili-cone resin included two stages:the first stage occurred at about 253 ºC due to the oxidative degradation of partial vinyl of side-linked branches of silicone resin;The second stage taking place at 578 ºC,which was caused by the random fracture and rear-rangement of SR skeletons due to the back reaction of silicone hydroxyl end groups of silicone resin.

何文峰;赵彤杰;谢于辉;梅毅;谢德龙

昆明理工大学化学工程学院,云南省磷化工节能与新材料重点实验室昆明,云南省磷资源技术创新中心,昆明 650500昆明理工大学化学工程学院,云南省磷化工节能与新材料重点实验室昆明,云南省磷资源技术创新中心,昆明 650500昆明理工大学化学工程学院,云南省磷化工节能与新材料重点实验室昆明,云南省磷资源技术创新中心,昆明 650500昆明理工大学化学工程学院,云南省磷化工节能与新材料重点实验室昆明,云南省磷资源技术创新中心,昆明 650500昆明理工大学化学工程学院,云南省磷化工节能与新材料重点实验室昆明,云南省磷资源技术创新中心,昆明 650500

化学工程

耐高温改性有机硅树脂热降解机理聚合物

high temperature modificationsilicone resinthermal degradation mechanismpolymer

《中国塑料》 2025 (1)

31-36,6

云南省磷化工节能与新材料重点实验室(202205AG070067)云南省磷资源技术创新中心(202305AK340002)

10.19491/j.issn.1001-9278.2025.01.006

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