中国塑料2025，Vol.39Issue(1)：44-47,4.DOI:10.19491/j.issn.1001-9278.2025.01.008
微电子元件注塑封装模流仿真工艺优化研究
Optimization of simulation process for injection molding packaging of microelectronic component
摘要
Abstract
Taking the microelectronic components based on a thermotropic liquid crystal polymer(TLCP)as a research object,the Moldflow analysis software was employed to simulate the injection molding process of the microelectronic components.The effect of different core structures on the injection molding of microelectronic components was com-pared,and the molding efficiency and molding quality of the microelectronic components in the injection molding process were analyzed.Through comparing the three-contact and two-contact inlay core structures,the optimal injection molding scheme was determined to be the two-contact inlay core structure.The two-contact inlay core structure had a filling time of 0.020 4 s,an ejection time of 0.123 5 s,an average volumetric shrinkage rate of 4.414%,and a comprehensive warpage deformation of 0.011 5 mm.These were determined to be the optimal injection molding scheme for the micro-electronic components.The average volume shrinkage and integrated warpage deformation were reduced by 0.149%and 0.002 7 mm,respectively.Although the two-contact inlay core structure showed poorer uniformity in fiber distribu-tion than the three-contact one,its volume shrinkage and warpage deformation were reduced due to the concentrated fiber distribution at the edge of the inner core.A comprehensive analysis indicated that the two-contact inlay core structure was the optimal scheme for the injection molding of microelectronic components.关键词
Moldflow/微电子元件/结构优化/纤维取向/翘曲变形Key words
Moldflow/microelectronic component/structure optimization/fiber orientation/warping deformation分类
化学化工引用本文复制引用
胡鲲鸣,王迪,金镖,阮剑波,刘万强,谢鹏程..微电子元件注塑封装模流仿真工艺优化研究[J].中国塑料,2025,39(1):44-47,4.基金项目
宁波市科技创新2025重大专项(2023Z029) （2023Z029）
