微电子元件注塑封装模流仿真工艺优化研究OA北大核心

Taking the microelectronic components based on a thermotropic liquid crystal polymer(TLCP)as a research object,the Moldflow analysis software was employed to simulate the injection molding process of the microelectronic components.The effect of different core structures on the injection molding of microelectronic components was com-pared,and the molding efficiency and molding quality of the microelectronic components in the injection molding process were analyzed.Through comparing the three-contact and two-contact inlay core structures,the optimal injection molding scheme was determined to be the two-contact inlay core structure.The two-contact inlay core structure had a filling time of 0.020 4 s,an ejection time of 0.123 5 s,an average volumetric shrinkage rate of 4.414%,and a comprehensive warpage deformation of 0.011 5 mm.These were determined to be the optimal injection molding scheme for the micro-electronic components.The average volume shrinkage and integrated warpage deformation were reduced by 0.149%and 0.002 7 mm,respectively.Although the two-contact inlay core structure showed poorer uniformity in fiber distribu-tion than the three-contact one,its volume shrinkage and warpage deformation were reduced due to the concentrated fiber distribution at the edge of the inner core.A comprehensive analysis indicated that the two-contact inlay core structure was the optimal scheme for the injection molding of microelectronic components.