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首页|期刊导航|半导体学报(英文版)|Synaptic devices based on silicon carbide for neuromorphic computing

Synaptic devices based on silicon carbide for neuromorphic computing

Boyu Ye Xiao Liu Chao Wu Wensheng Yan Xiaodong Pi

半导体学报(英文版)2025,Vol.46Issue(2):37-51,15.
半导体学报(英文版)2025,Vol.46Issue(2):37-51,15.DOI:10.1088/1674-4926/24100020

Synaptic devices based on silicon carbide for neuromorphic computing

Synaptic devices based on silicon carbide for neuromorphic computing

Boyu Ye 1Xiao Liu 2Chao Wu 3Wensheng Yan 1Xiaodong Pi4

作者信息

  • 1. Institute of Carbon Neutrality and New Energy,School of Electronics and Information,Hangzhou Dianzi University,Hangzhou 310018,China
  • 2. Institute of Carbon Neutrality and New Energy,School of Electronics and Information,Hangzhou Dianzi University,Hangzhou 310018,China||State Key Laboratory of Polymer Materials Engineering,Sichuan University,Chengdu 610065,China
  • 3. Sorbonne Université,Faculté des Sciences,CNRS,Institut Parisien de Chimie Moléculaire(IPCM),UMR 8232,4 Place Jussieu,75005 Paris,France
  • 4. State key Laboratory of Silicon and Advanced Semiconductor Materials&School of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China||Institute of Advanced Semiconductors&Zhejiang Provincial Key Laboratory of Power Semiconductor Materials and Devices,ZJU-Hangzhou Global Scientific and Technological Innovation Center,Zhejiang University,Hangzhou 311200,China
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摘要

关键词

silicon carbide/wide bandgap semiconductors/synaptic devices/neuromorphic computing/high temperature

Key words

silicon carbide/wide bandgap semiconductors/synaptic devices/neuromorphic computing/high temperature

引用本文复制引用

Boyu Ye,Xiao Liu,Chao Wu,Wensheng Yan,Xiaodong Pi..Synaptic devices based on silicon carbide for neuromorphic computing[J].半导体学报(英文版),2025,46(2):37-51,15.

基金项目

This work is supported by the Natural Science Founda-tion of Zhejiang Province(Grant No.LQ24F040007),the National Natural Science Foundation of China(Grant No.U22A2075),and the Opening Project of State Key Laboratory of Polymer Materials Engineering(Sichuan University)(Grant No.sklpme2024-1-21). (Grant No.LQ24F040007)

半导体学报(英文版)

1674-4926

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