桂林电子科技大学学报Issue(5)：505-510,6.DOI:10.16725/j.1673-808X.2022335
OPS/ZIF-67/PI复合材料薄膜的制备与性能
Preparation and properties of OPS/ZIF-67/PI composite material film
摘要
Abstract
The development of integrated circuits requires materials with low dielectric constant materials,and the dielectric con-stant of polymers can be reduced by adding nanocavity materials in.Polyimide(PI)synthesized by 3,3',4,4'-biphenyltetracarboxylic dianhydride(BPDA)and 4,4'-diaminodiphenyl ether(ODA)was used as the matrix,and ZIF-67 and OPS were introduced as nano-fillers to prepare ZIF-67/PI,OPS/PI,and OPS/ZIF-67/PI composite films.The ZIF-67 and the above three composite films were characterized by Fourier transform infrared spectroscopy,scanning electron microscopy and X-ray diffractometer to study the ef-fects of the contents of ZIF-67 and OPS on the thermal stability and dielectric properties of the composite films.The experimental results showed that the thermal stability of OPS/ZIF-67/PI composite films decreased compared with that of PI when a certain mass fraction of ZIF-67 and OPS were added,but their decomposition temperature was still greater than 440 ℃,which had good thermal stability;the dielectric constant of OPS/ZIF-67/PI composite films was lower than that of pure PI films when the mass fraction of OPS was When the mass fraction of OPS is 5％and the mass fraction of ZIF-67 is 7％,the dielectric constant of OPS/ZIF-67/PI composite film is 0.69(1 kHz),which is 58.2％lower than the dielectric constant of ZIF-67/PI composite film with 7％ZIF-67 addi-tion(1.65,1 kHz),and the dielectric constant of OPS/PI composite film with 5％OPS addition is 58.2％lower than the dielectric constant of ZIF-67/PI composite film with 7％ZIF-67 addition.The dielectric constant of the composite film(2.52,1 kHz)de-creased by 72.6％relative to that of the pure PI(2.98,1 kHz),and by 76.8％relative to that of the pure PI(2.98,1 kHz).The dielec-tric loss of the composite films increased slightly when a certain mass fraction of OPS with ZIF-67 was added.关键词
聚酰亚胺/ZIF-67/OPS/热稳定性/介电性能Key words
polyimide/ZIF-67/OPS/thermal stability/dielectric properties分类
信息技术与安全科学引用本文复制引用
田磊,戴培邦,张倍铭..OPS/ZIF-67/PI复合材料薄膜的制备与性能[J].桂林电子科技大学学报,2024,(5):505-510,6.基金项目
广西创新驱动发展专项资金项目(桂科AA18242010) （桂科AA18242010）
