硅酸盐通报2025，Vol.44Issue(2)：707-716,10.DOI:10.16552/j.cnki.issn1001-1625.2024.0916
玻璃基板在芯片封装中的应用和性能要求
Application and Performance Requirements of Glass Substrates in Chip Packaging
摘要
Abstract
Glass substrates are set to become a critical material in advanced packaging technologies due to their superior high-frequency electrical properties,thermal stability,and chemical durability.This paper examines the roles and advantages of glass substrates in the packaging process,highlighting their applications in intermediary layers,fan-out packaging,micro-electro-mechanical system packaging,and integrated antenna packaging.This paper also summarizes the common composition and key physicochemical properties of glass substrates used in chip packaging,and provides insights into their future development.关键词
玻璃基板/芯片封装/玻璃通孔/硼硅玻璃/铝硅玻璃/无碱玻璃Key words
glass substrate/chip packaging/through glass via/borosilicate glass/aluminum-silicon glass/alkali-free glass分类
化学化工引用本文复制引用
张兴治,田英良,赵志永,张迅,王如志..玻璃基板在芯片封装中的应用和性能要求[J].硅酸盐通报,2025,44(2):707-716,10.基金项目
国家重点研发计划(2022YFB3603305) （2022YFB3603305）
