机电工程技术2025，Vol.54Issue(4)：90-94,176,6.DOI:10.3969/j.issn.1009-9492.2025.04.015
微整形磨粒电镀金刚石线锯切片表面质量分析
Surface Quality Analysis of Electroplated Diamond Wire Saw Slice with Micro-shaping Abrasive Grain
摘要
Abstract
To investigate the effect of micro shaped abrasive grain electroplated diamond wire saw on the surface quality of sliced silicon during processing,and to study the influence of wire speed and feed rate on the surface quality of sliced silicon,sawing experiments are conducted on single crystal silicon using a reciprocating diamond wire cutting machine.After the slicing is completed,the roughness of the sliced surface is firstly measured using a surface roughness meter,and then the morphology of the sliced surface and the wear state of the wire saw are observed using a scanning electron microscope.The test results show that the roughness of the surface of the slices obtained by wire saw machining with micro-shaping grit plating is lower along the wire travelling direction than that along the feeding direction.Changes in wire travelling speed and feed speed have a significant effect on the surface roughness of silicon wafers along the feed direction,while changes in roughness along the wire travelling direction are small.The surface roughness along the feed direction decrease by 30.4%and 30.5%when the wire travelling speed is increased from 6 m/s to 8 m/s and 13 m/s,respectively;and the surface roughness along the feed direction decreases by 18.4%and 45.5%when the feed speed is reduced from 2 μm/s to 1 μm/s and 0.6 μm/s,respectively.As the wire travelling speed increases and the feed rate decreases,the brittle cratering craters on the wafer surface decrease,while the plastic shear grooves increase,and the surface morphology is improved.The material removal during micro-shaping grit plated diamond wire sawing is a coexistence of two modes of plastic and brittle removal.Wear on wire saws is mainly characterised by abrasive wear,flattening and dulling of the abrasive grains,with a small amount of abrasive grains falling off and breaking up.关键词
微整形磨粒/电镀金刚石线锯/单晶硅/表面质量Key words
micro-shaping abrasives/electroplated diamond wire saws/single-crystal silicon/surface quality分类
矿业与冶金引用本文复制引用
赵桂丽,葛梦然,刘尧,姜鹏程,刘志东,吕志杰..微整形磨粒电镀金刚石线锯切片表面质量分析[J].机电工程技术,2025,54(4):90-94,176,6.基金项目
国家自然科学基金(52005301) （52005301）
