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A method for quantitatively evaluating the impact of defects on wall U-value using infrared thermal imaging

Shu Zheng Fulin Hao Youcun Lu Tingting Jiang Xudong Yang

建筑模拟（英文版）2025，Vol.18Issue(2)：281-293,13.

建筑模拟（英文版）2025，Vol.18Issue(2)：281-293,13.DOI:10.1007/s12273-024-1213-7

A method for quantitatively evaluating the impact of defects on wall U-value using infrared thermal imaging

Shu Zheng ¹Fulin Hao ¹Youcun Lu ²Tingting Jiang ¹Xudong Yang³

作者信息

1. Department of Building Science,Tsinghua University,Beijing 100084,China
2. China Nuclear Power Technology Research Institute Co.,Ltd,Shenzhen 518000,China
3. Department of Building Science,Tsinghua University,Beijing 100084,China||Shanxi Research Institute for Clean Energy,Tsinghua University,Taiyuan 030032,China
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摘要

关键词

infrared thermography/thermal defects/heat transfer coefficient/K-means algorithm/thermal defect quantification

Key words

infrared thermography/thermal defects/heat transfer coefficient/K-means algorithm/thermal defect quantification

引用本文复制引用

Shu Zheng,Fulin Hao,Youcun Lu,Tingting Jiang,Xudong Yang..A method for quantitatively evaluating the impact of defects on wall U-value using infrared thermal imaging[J].建筑模拟（英文版）,2025,18(2):281-293,13.

基金项目

This study was funded by the China Postdoctoral Science Foundation(2024M751701). （2024M751701）

建筑模拟（英文版）

ISSN：1996-3599

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