人工晶体学报2025，Vol.54Issue(2)：290-311,22.DOI:10.16553/j.cnki.issn1000-985x.2024.0267
超宽带隙氧化镓功率器件热管理的研究进展
Recent Progress on Thermal Management of Ultrawide Bandgap Gallium Oxide Power Devices
摘要
Abstract
The low thermal conductivity of ultrawide bandgap(UWBG)gallium oxide(β-Ga2O3)is the most significant bottleneck restricting the development of its power devices,posing a huge challenge for efficient heat dissipation under high-power density conditions.Therefore,developing new thermal management and packaging technologies is extremely urgent.It is crucial to alleviate the performance and reliability issues caused by self-heating through thermal management at the material,device,and packaging levels.This paper provides a timely review of the state of the art in thermal management of UWBGβ-Ga2O3 power devices,discussing related challenges,potential solutions,and research opportunities.The paper firstly introduces the characteristics of UWBG β-Ga2O3 and its significance in electronic devices,and elaborates on the crucial firstly importance of thermal management in β-Ga2O3 devices.Then,various thermal management techniques,including substrate-related methods and junction-side thermal management techniques,are thoroughly examined,and their impact on the electrical properties of β-Ga2O3 devices is analyzed.Finally,the future development trends of thermal management for UWBG β-Ga2O3 devices are prospected.Multi-dimensional thermal management strategies are proposed,focusing on"material-device-packaging"electrothermal collaborative design,near junction heterogeneous integration,and novel external packaging,aiming to arouse relevant research and accelerate the development and industrialization process of UWBGβ-Ga2O3 power devices.关键词
热管理/超宽带隙/氧化镓/材料-器件-封装/结侧散热/高导热率衬底集成/电热协同设计Key words
thermal management/ultrawide bandgap(UWBG)/gallium oxide(β-Ga2O3)/material-device-packaging/junction-side heat dissipation/integration of high thermal conductivity substrate/electrothermal co-design分类
信息技术与安全科学引用本文复制引用
谢银飞,何阳,刘伟业,徐文慧,游天桂,欧欣,郭怀新,孙华锐..超宽带隙氧化镓功率器件热管理的研究进展[J].人工晶体学报,2025,54(2):290-311,22.基金项目
集成电路材料全国重点实验室开放课题(SKLIC-K2024-04) （SKLIC-K2024-04）
广东省科技创新青年拔尖人才项目(2021TQ06C953) （2021TQ06C953）
深圳市基础研究面上项目(JCYJ20190806142614541) （JCYJ20190806142614541）
