宇航材料工艺2025，Vol.55Issue(1)：29-36,8.DOI:10.12044/j.issn.1007-2330.2025.01.004
耐高温双马来酰亚胺树脂的分子动力学模拟研究
Research on Molecular Dynamic Simulation of High Temperature Resistant Bismaleimide Resin
杨沛文 1张东 2杨小平 1李刚1
作者信息
- 1. 北京化工大学有机无机复合材料国家重点实验室,北京 100029
- 2. 航天材料及工艺研究所,北京 100076
- 折叠
摘要
Abstract
Based on the curing mechanism of bismaleimide resin,dynamic in-situ curing programs were developed to simulate the pre-polymerization and crosslinking of bismaleimide,a two steps method was used to construct a molecular dynamic(MD)model of high temperature resistant bismaleimide resin,and predictions were made regarding its model structure,thermomechanical properties,and resin stiffness.The curing reaction conversion rate and the density of the curing model during the pre-polymerization and crosslinking process of bismaleimide resin are consistent with the actual values,proving that the dynamic in-situ curing program achieves the curing program achieved the curing reaction of the experimental process.Meanwhile,during the simulated curing process from resin precursor to per-polymer to crosslinked model,the resin model gradually transitions from a high-viscosity liquid state to a high-density network structure solid polymer state,verifying the rationality of the curing program.The predicted glass transition temperature and Yong's modulus based on the density,volume change rate,and elastic stiffness matrix of the bismaleimide resin curing model are close to the experimental results,confirming the reliability of the this bismaleimide resin model and its suitability for the bismaleimide resin system.关键词
耐高温双马/分子动力学模拟/动态原位固化程序/转化率/玻璃化转变温度/杨氏模量Key words
High temperature resistant bismaleimide resin/Molecular dynamic simulation/Dynamic in-situ curing procedure/Conversion rate/Glass transition temperature/Young's modulus引用本文复制引用
杨沛文,张东,杨小平,李刚..耐高温双马来酰亚胺树脂的分子动力学模拟研究[J].宇航材料工艺,2025,55(1):29-36,8.
