宇航材料工艺2025，Vol.55Issue(1)：87-92,6.DOI:10.12044/j.issn.1007-2330.2025.01.012
3D封装BGA器件控温焊接工艺研究
Research on Temperature Controlled Reflow Soldering Process for 3D Packaged BGA Device
郭立 1高鹏 2张婷婷 2耿煜 2田翔文2
作者信息
- 1. 中国空间技术研究院,北京 100094
- 2. 航天恒星科技有限公司,北京 100095
- 折叠
摘要
Abstract
The 3D packaged BGA devices used in aerospace had temperature limitations during the soldering process of printed circuit board assemblies,which were incompatible with the soldering temperature of other large-sized surface array devices(such as BGA,CCGA,LGA).Therefore,temperature controlled soldering was required for the 3D BGA devices during the reflow soldering process.This article designed a reflow soldering temperature controlled soldering fixture for 3D packaged BGA devices,established a thermal simulation model,simulated the soldering process of the device during reflow soldering.Additionally,experiments were conducted on the reflow soldering process using the temperature controlled fixture to verify the accuracy of the simulation data.The results show that temperature control fixtures can effectively reduce device temperature,and the top of the fixture blocks the upper jet in the welding environment,which has the greatest impact on device temperature.The experimental results are consistent with the simulation results,proving that the simulation results are accurate and effective,and simulation methods can be used to reduce the experimental period.Microstructure analysis is conducted on the device after reflow soldering using fixtures.The solder joints of the device are intact,without obvious defects,and the internal state is good.The solder joints form a continuous scallop shaped interface layer,and the thickness of the IMC layer meet the requirements of aerospace standards.关键词
3D封装/BGA/控温/回流焊/仿真分析Key words
3D packaging/BGA/Temperature control/Reflow soldering/Simulation analysis分类
信息技术与安全科学引用本文复制引用
郭立,高鹏,张婷婷,耿煜,田翔文..3D封装BGA器件控温焊接工艺研究[J].宇航材料工艺,2025,55(1):87-92,6.
