宇航材料工艺2025，Vol.55Issue(1)：108-113,6.DOI:10.12044/j.issn.1007-2330.2025.01.016
高温高湿下导电胶黏剂老化失效机理研究
Study on the Aging Failure Mechanism of Isotropic Conductive Adhesive Under High Temperature and Humidity
张新兰 1许文 1梁晓凡 1丁孝均 1张欢1
作者信息
- 1. 航天材料及工艺研究所,北京 100076
- 折叠
摘要
Abstract
The aging failure mechanism of isotropic conductive adhesive under high temperature and humidity was studied.The microstructure of the material before and after aging was characterized by scanning electron microscope(SEM),electrochemical impedance spectroscopy(EIS)and X-ray photoelectron spectroscopy(XPS).The results show that under high temperature and high humidity,due to the post-curing shrinkage of the adhesive,the decrease in the bonding interface strength,and the difference in the thermal expansion coefficient with the bonded material,microcracks are generated at the bonding interface and expand with time.Under the same aging temperature and aging time,the presence of humidity promotes the formation and expansion of microcracks at the bonding interface.XPS results show that after aging under high temperature and high humidity,the proportion of"inorganic silicon"on the surface of the sample significantly increases.关键词
导电胶黏剂/高温高湿/失效机理Key words
Isotropic conductive adhesive/High temperature and humidity/Failure mechanism分类
通用工业技术引用本文复制引用
张新兰,许文,梁晓凡,丁孝均,张欢..高温高湿下导电胶黏剂老化失效机理研究[J].宇航材料工艺,2025,55(1):108-113,6.
