电焊机2025，Vol.55Issue(3)：117-121,5.DOI:10.7512/j.issn.1001-2303.2025.03.16
高熵合金复合钎料钎焊接头组织及性能研究
Study on Microstructure and Properties of Brazed Joint of High-entropy Alloy Composite Solders
王东亮 1薛行雁 1张陕南1
作者信息
- 1. 中国机械总院集团郑州机械研究所有限公司 新型钎焊材料与技术国家重点实验室,河南 郑州 450001
- 折叠
摘要
Abstract
To address the issues of poor processability in Cu-based solders and base metal structural degradation caused by high-temperature brazing in carbon steel,this study developed a novel silver-free composite solder by incorporating Sn28Ag18Cu18Ga18Bi18 high-entropy alloy as a metallic binder with Cu62Sn22Ni6Mn10 solder.The composite solder was fabri-cated through powder metallurgy,achieving a significantly reduced brazing temperature of 770℃compared to conventional Cu-based solders.Microstructural analysis revealed that the high-entropy effect effectively suppressed Fe element diffusion,restricting the interfacial intermetallic compound layer thickness to 0.8 μm while minimizing brittle phase formation in the joint.Mechanical testing demonstrated a tensile strength of 265 MPa for the composite brazed joint,representing approxi-mately 32%enhancement over the single Cu-based solder.Structural characterization confirmed the composite solder com-prised Ag0.72Ga0.28 compounds,Sn-based solid solutions,and Bi phases,with optimized elemental diffusion behavior.This composite solder system provides an innovative low-temperature brazing solution for carbon steel,combining superior pro-cessability with enhanced mechanical performance.关键词
高熵合金/Cu基钎料/复合钎料/钎焊/抗拉强度Key words
high entropy alloy/Cu-based filler metal/composite solders/brazing/tensile strength分类
矿业与冶金引用本文复制引用
王东亮,薛行雁,张陕南..高熵合金复合钎料钎焊接头组织及性能研究[J].电焊机,2025,55(3):117-121,5.
