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Thermal Contact Resistance and Heat Transfer Enhancement Mechanisms at Non-Smooth Contact Interfaces

WANG Yifan SUN Xiaoxia KANG Huifang MA Xinglong ZHANG Tao

热科学学报（英文版）2025，Vol.34Issue(2)：465-497,33.

热科学学报（英文版）2025，Vol.34Issue(2)：465-497,33.DOI:10.1007/s11630-025-2086-5

Thermal Contact Resistance and Heat Transfer Enhancement Mechanisms at Non-Smooth Contact Interfaces

WANG Yifan ¹SUN Xiaoxia ²KANG Huifang ¹MA Xinglong ¹ZHANG Tao²

作者信息

1. School of Mechanical Engineering,Beijing Institute of Technology,Beijing 100081,China
2. China North Vehicle Research Institute,Beijing 100072,China
折叠

摘要

关键词

Thermal Contact Resistance(TCR)/Thermal Interfacial Material(TIM)/contact interface/theoretical and empirical model/heat transfer

Key words

Thermal Contact Resistance(TCR)/Thermal Interfacial Material(TIM)/contact interface/theoretical and empirical model/heat transfer

引用本文复制引用

WANG Yifan,SUN Xiaoxia,KANG Huifang,MA Xinglong,ZHANG Tao..Thermal Contact Resistance and Heat Transfer Enhancement Mechanisms at Non-Smooth Contact Interfaces[J].热科学学报（英文版）,2025,34(2):465-497,33.

基金项目

This work was supported by the National Natural Science Foundation of China(Grant No.52102445). （Grant No.52102445）

热科学学报（英文版）

ISSN：1003-2169

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