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Enhanced Conductivity of Multilayer Copper-Carbon Nanofilms via Plasma Immersion Deposition

Haotian Weng Xiwu Zhang Xuan Liu Yunhui Tang Hewei Yuan Yang Xu Kun Li Xiaolu Huang

Nano-Micro Letters2025，Vol.17Issue(6)：P.112-127,16.

Nano-Micro Letters2025，Vol.17Issue(6)：P.112-127,16.DOI:10.1007/s40820-024-01628-6

Enhanced Conductivity of Multilayer Copper-Carbon Nanofilms via Plasma Immersion Deposition

Haotian Weng ¹Xiwu Zhang ²Xuan Liu ³Yunhui Tang ⁴Hewei Yuan ¹Yang Xu ¹Kun Li ¹Xiaolu Huang¹

作者信息

1. Key Laboratory for Thin Film and Microfabrication of Ministry of Education,Research Institute of Micro/Nano Science and Technology,Shanghai Jiao Tong University,Shanghai 200240,People’s Republic of China
2. Jinduo Yuchen Water Environment Engineering Co.,Ltd,Shanghai 200030,People’s Republic of China
3. Department of Mechanical Engineering College of Engineering,Shanghai Ocean University,Shanghai 201306,People’s Republic of China
4. Faculty of Materials and Manufacturing,Beijing University of Technology,Beijing 100124,People’s Republic of China
折叠

摘要

关键词

Copper-carbon nanofilms/Plasma immersion/Carbon layer deposition/Electron mobility

分类

通用工业技术

引用本文复制引用

Haotian Weng,Xiwu Zhang,Xuan Liu,Yunhui Tang,Hewei Yuan,Yang Xu,Kun Li,Xiaolu Huang..Enhanced Conductivity of Multilayer Copper-Carbon Nanofilms via Plasma Immersion Deposition[J].Nano-Micro Letters,2025,17(6):P.112-127,16.

基金项目

support from the National Natural Science Foundation of China(61574091) （61574091）

National Natural Science Foundation of China Key Program(50730008). （50730008）

Nano-Micro Letters

ISSN：2311-6706

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