铁道科学与工程学报2025，Vol.22Issue(3)：1383-1395,13.DOI:10.19713/j.cnki.43-1423/u.T20240704
基于反射特征辨识的IGBT焊料层老化状态评估
Aging status evaluation of IGBT solder layer based on reflection feature identification
摘要
Abstract
The insulated-gate bipolar transistor(IGBT),as a core electrical component in fields such as electrified transportation and new energy,plays a crucial role in traction drive,converter control,and auxiliary lighting power supply system.Aging of the solder layer is a typical degradation form of IGBT modules,while the acquisition of void and crack parameters,which serve as evaluation indicators of aging status,is limited by the external encapsulation of the module,aiming to achieve its state assessment while ensuring the integrity of the monitoring object.Firstly,based on the transmission line theory and the spread spectrum time domain reflectometry(SSTDR)method,an IGBT reflection signal detection scheme was proposed.A reflection wave analysis and fitting algorithm was introduced to extract the target and identify the features of the overlapping sampled signals.Subsequently,based on the consideration of the degradation mechanism of the solder layer,an analytical model of the equivalent impedance at the module chip terminal was constructed.Moreover,a mapping correlation between"signal-impedance-solder layer"was established.Taking the SKM50GB12T4 type IGBT as an example,power cycling accelerated aging experiments were conducted to clarify the trend of void rate variation with the aging status of the solder layer.Lastly,based on signal transmission and device impedance modeling theories,a study was conducted on the identification of reflection signal characteristics for aging samples at different stages.The variation patterns of signal feature parameters with device degradation processes were analyzed,providing a basis for the assessment of solder layer aging status.The research results indicate that the detected terminal impedance during the aging process exhibits a trend of initial slow decrease(dominated by parasitic capacitance)followed by rapid increase(dominated by voids and chips growth).This consistent trend is observed in the variation of reflection signal feature parameters,which aligns with the impedance analysis results reflecting the void growth pattern.Therefore,based on the incremental properties of the feature parameters,the service life cycle can be divided into four stages:healthy,slow degradation,rapid deterioration,and failure damage.Compared to the evaluation method based on void statistics,this method can indirectly characterize the development trend of voids in the solder layer through signal reflection characteristics,overcoming certain limitations of internal parameter monitoring schemes.The research results can provide a new approach for non-destructive detection and assessment of the aging status of IGBT solder layers.关键词
芯片焊料层/空洞率/老化状态评估/拓展频谱时域反射/信号特征辨识Key words
chip solder layer/void rate/aging status assessment/spread spectrum time domain reflectometry/signal feature identification分类
交通运输引用本文复制引用
王为介,刘畅,陈钰洁,成庶,向超群,袁炜钰,赵洪利..基于反射特征辨识的IGBT焊料层老化状态评估[J].铁道科学与工程学报,2025,22(3):1383-1395,13.基金项目
动车组和机车牵引与控制国家重点实验室开放课题(2022YJ273) （2022YJ273）
