航空材料学报2025，Vol.45Issue(2)：82-90,9.DOI:10.11868/j.issn.1005-5053.2024.000072
新型耐高温防霉剂的制备及应用
Preparation and application of high-temperature-resistant fungicide
王磊 1任河 1张玥 1孙全吉 1范召东2
作者信息
- 1. 中国航发北京航空材料研究院,北京 100095
- 2. 北京航空材料研究院股份有限公司,北京 100095
- 折叠
摘要
Abstract
Nano-Ag was deposited onto the surface of T-ZnOw through a process combining dopamine deposition with the chemical reduction of silver,yielding a novel silver-zinc fungicide.The study explored the impact of dopamine deposition duration and silver ammonia solution concentration on the deposition efficacy of nano-Ag,ultimately determining the optimal reaction conditions.The incorporation of this silver-zinc fungicide enhance the antifungal properties of the silicone sealant,without compromising its heat resistance or adhesion.Furthermore,the mold-proof rating of the aged sealant remain at level 1,demonstrating the excellent thermal stability of the T-ZnOw/PDA/Ag fungicide.关键词
四针状氧化锌晶须/防霉/纳米银/耐高温/有机硅密封剂Key words
tetrapod-like ZnO whisker(T-ZnOw)/antifungal/nano-Ag/high-temperature-resistant/silicone sealant分类
航空航天引用本文复制引用
王磊,任河,张玥,孙全吉,范召东..新型耐高温防霉剂的制备及应用[J].航空材料学报,2025,45(2):82-90,9.
