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氧化物TFT源栅极短路缺陷原因解析及抑制措施

刘丹 王章涛 张浩雄 谌伟 王念念 熊永 黄中浩 樊小军 陈威 刘巍 刘川 杜宏伟 杨生 吴旭 闵泰烨

液晶与显示2025,Vol.40Issue(4):566-576,11.
液晶与显示2025,Vol.40Issue(4):566-576,11.DOI:10.37188/CJLCD.2024-0338

氧化物TFT源栅极短路缺陷原因解析及抑制措施

Mechanism analysis and suppression measures for gate data short defects in oxide TFT

刘丹 1王章涛 2张浩雄 2谌伟 1王念念 1熊永 1黄中浩 1樊小军 3陈威 3刘巍 3刘川 4杜宏伟 1杨生 1吴旭 1闵泰烨1

作者信息

  • 1. 重庆京东方光电科技有限公司,重庆 400700
  • 2. 京东方科技集团股份有限公司,北京 100176
  • 3. 联想集团质量技术委员会,北京 100006
  • 4. 中山大学 电子与信息工程学院,广东 广州 510275
  • 折叠

摘要

Abstract

Gate data short(DGS)defects in IGZO TFT lead to deterioration of display performance and product scrap.It is necessary to identify the DGS mechanism,recognize the impact factors,and propose a solution to ensure the yield.In this paper,the macroscopic phenomena and microscopic morphology of DGS were analyzed.After that,the relationship between the dielectric loss of gate insulator(GI)and break-down voltage was explored.Then,the deterioration of display tests were conducted,and the DGS rate of different products was statistically analyzed,the effects of gate voltage and refresh rate on DGS rate were identified.Next,the experimental phenomenon is matched with the investigated DGS mechanism.Subsequently,the reasons for oxide TFT DGS being higher than a-Si TFT were analyzed.The results show that the essential of DGS is GI dielectric breakdown due to insufficient dielectric withstanding strength,while GI dielectric loss,gate voltage,and refresh rate are all the significant influencing factors of DGS.These factors,in the interaction of Cu diffusion and Cu electromigration mechanisms,reduce the GI effective thickness and increase the risk of GI thermal breakdown,which ultimately results in DGS.DGS can be suppressed by reducing thickness ratio of SiOx in the stacked GI aiming at decreasing dielectric loss and inhibiting thermal breakdown;Alternatively,DGS is ultimately suppressed by decreasing gate voltage to inhibit Cu diffusion and electromigration.By introducing the above measures as an improvement plan,the incidence rate of DGS was decreased by 73%,which successfully suppressed the DGS rate of the oxide panel and improved the product quality,providing a reference for oxide TFT process optimization.

关键词

铟镓锌氧化物/薄膜晶体管/电迁移/电介质击穿

Key words

IGZO/thin film transistor/electric migration/dielectric breakdown

分类

电子信息工程

引用本文复制引用

刘丹,王章涛,张浩雄,谌伟,王念念,熊永,黄中浩,樊小军,陈威,刘巍,刘川,杜宏伟,杨生,吴旭,闵泰烨..氧化物TFT源栅极短路缺陷原因解析及抑制措施[J].液晶与显示,2025,40(4):566-576,11.

基金项目

重庆京东方科技攻关项目(No.306053)Supported by Scientific and Technological Project of Chongqing BOE Optoelectronics Technology Co.Ltd.(No.306053) (No.306053)

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