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宽带内多目标信号原始数据分离技术实现

郭静 黄朋 隋晓波

集成电路与嵌入式系统2025,Vol.25Issue(4):66-71,6.
集成电路与嵌入式系统2025,Vol.25Issue(4):66-71,6.DOI:10.20193/j.ices2097-4191.2025.0002

宽带内多目标信号原始数据分离技术实现

Realization of raw data separation of multiple target signals within broadband

郭静 1黄朋 1隋晓波1

作者信息

  • 1. 中国电子科技集团公司第四十一研究所,青岛 266000
  • 折叠

摘要

Abstract

Under complex electromagnetic environment conditions,multiple target signals appear simultaneously.The comprehensive testing system needs to have independent real-time analysis capabilities for simultaneously arriving signals.Due to the huge amount of broadband data,existing systems cannot seamlessly extract and process multiple target signals in real time.To meet the extraction re-quirements of high-density target signal raw IQ data within broadband,this paper uses FPGA high-speed digital signal processing tech-nology to achieve multi-channel down conversion at any frequency point within the analysis bandwidth and variable analysis bandwidth extraction filtering.Combined with framing and time-sharing scheduling read control,it can simultaneously separate up to 32 channels of target signal raw IQ data with a maximum analysis bandwidth of 300 kHz within an 80 MHz intermediate frequency bandwidth using DDR4 buffering and PCIe 3.0×8 bus transmission.The system adapts dynamically to transmit multi-channel IQ data at different rates while displaying the broadband signal spectrum,achieving seamless transmission of multi-channel IQ data.During the measurement process,it supports the real-time modification of the number,frequency,and bandwidth parameters of the target signal.This technology lays the foundation for real-time analysis of multi-target signal parameters within broadband,and improves the real-time analysis and processing capabilities of high-density signals in comprehensive testing systems.

关键词

数字下变频/DDC/PCIe/IQ数据/FPGA

Key words

digital down conversion/DDC/PCIe/IQ data/FPGA

分类

电子信息工程

引用本文复制引用

郭静,黄朋,隋晓波..宽带内多目标信号原始数据分离技术实现[J].集成电路与嵌入式系统,2025,25(4):66-71,6.

基金项目

国家重点研发计划资助(2023YFF0717400) (2023YFF0717400)

国防基础科研计划资助(JCKY2022210B006). (JCKY2022210B006)

集成电路与嵌入式系统

1009-623X

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