化工进展2025，Vol.44Issue(3)：1542-1549,8.DOI:10.16085/j.issn.1000-6613.2024-1433
甲基红对电沉积铜行为的影响及在通孔填性中的应用
Influence of methyl red on the behavior of electrodeposited copper and its application in through-hole filling
摘要
Abstract
Electroplating copper within through-holes serves as a crucial technique for interconnecting high-performance printed circuit boards(PCBs).Improving the throwing power(TP)of copper plating through these holes is essential for advancing PCB technology.This article explored the influence of methyl red(MR)on three key aspects:the electrochemical behavior of the plating solution,the surface morphology of the electrodeposited copper layer and the uniformity of through-hole copper plating.Firstly,electrochemical assessments were conducted to examine how methyl red and flow velocity affect the performance of acidic copper electroplating systems.Subsequently,copper layers were electrodeposited within through-holes,and the effects of methyl red on the surface morphology of these copper layers were investigated through roughness measurements and X-ray diffraction analysis.Finally,to evaluate the effect on plating uniformity,cross-sections of the through-holes were prepared and analyzed by using a metallographic microscope.Within the range of 0-1600r/min,increasing convective velocity accelerated the copper deposition rate.Additionally,as the concentration of methyl red increases from 0 to 9mg/L,the deposition rate initially increased and then slowed down.Under the condition of a current density of 2A/dm2,the addition of 6mg/L MR could enhance the brightness of the copper layer surface,reduce the roughness to 0.287μm,and improve the TP of the plated through hole to 0.978.To summarize,methyl red was a special copper electroplating leveler with a depolarization effect.关键词
通孔/电镀铜/甲基红/表面形貌Key words
through hole/copper electroplating/methyl red/surface topography分类
化学化工引用本文复制引用
张洋,张艺洁,张鸿志,钱懋林,向静..甲基红对电沉积铜行为的影响及在通孔填性中的应用[J].化工进展,2025,44(3):1542-1549,8.基金项目
重庆市教委科学技术研究计划(KJQN202202902 （）
KJZD-M202401304 （）
KJZD-K202201306) （）
重庆市自然科学基金(CSTB2022NSCQ-MSX0526) （CSTB2022NSCQ-MSX0526）
校级重点实验室科研平台(2021KYPT-04). （2021KYPT-04）
