世界有色金属Issue(4)：221-225,5.
基于纳米压痕法的IMC颗粒增强型非均质Sn58Bi焊料弹塑性本构方程反演分析
Inverse analysis of elastoplastic constitutive equation for non-homogeneous Sn58Bi solder reinforced with IMC particles using nanoindentation method
摘要
Abstract
With the rapid iteration of technology in the electronic packaging industry and the growing demand for green manufacturing,high-temperature solder alloys such as Sn-Ag-Cu are gradually facing challenges.In order to explore the mechanical properties of Sn58Bi-xIMC(Cu-Sn)particle-reinforced solder and provide theoretical guidance and technical support for the design and development of new solder materials,the load-displacement curves of the new solder material were obtained using nanoindentation technology.Dimensional analysis was employed to determine the strain hardening exponent and initial characteristic stress of the new solder material,and finite element techniques were used to iteratively invert the characteristic stress and strain of the new solder material.The obtained parameters were then applied to a power-law strengthening model,and through continuous iterative analysis using finite element models,the yield strengths of Sn58Bi and Sn58Bi-0.5wt.%IMC(Cu-Sn)particle-reinforced solder were calculated to be 42.3224 and 47.0769 MPa,respectively.Finally,the elastic-plastic constitutive equations for Sn58Bi and Sn58Bi-0.5wt.%IMC(Cu-Sn)were derived through inverse analysis.关键词
Sn58Bi/纳米压痕法/有限元分析/反演分析/第二相强化Key words
Sn58Bi/nanoindentation method/finite element analysis/inverse analysis/second phase reinforcement分类
矿业与冶金引用本文复制引用
周翼钒,秦红波..基于纳米压痕法的IMC颗粒增强型非均质Sn58Bi焊料弹塑性本构方程反演分析[J].世界有色金属,2025,(4):221-225,5.基金项目
2023年桂林电子科技大学研究生教育创新项目(基金编辑:2023YCXS007). （基金编辑:2023YCXS007）
