电焊机2025，Vol.55Issue(4)：40-48,9.DOI:10.7512/j.issn.1001-2303.2025.04.06
SPS工艺下Ti中间层连接SiC陶瓷的接头组织与强度研究
Microstructure and Strength of SiC Ceramic Joints Diffusion Bonded by Sparks Plasma Sintering with the Ti Interlayer
摘要
Abstract
In this study,the 20 μm high-purity Ti films were used as the interlayer,and the pressureless-sintered SiC was used as the substrate,for joining of SiC ceramics by the spark plasma sintering.The microstructure and strength of SiC joints under different holding times were investigated by means of scanning electron microscopy,electron energy spectros-copy,shear strength tests,transmission electron microscopy,and X-ray diffractometer.Through shear tests,the shear strengths of the SiC joints bonded under different holding times were compared.There is a certain correlation between the average shear strength of the joints and the holding time.The average shear strength of the joint with a holding time of 5 min was 51.57 MPa.When the holding time was extended to 10 min,the average shear strength of the joint increased to 54.83 MPa.When the holding time was further extended to 20 min,the average shear strength of the joint reached 58.65 MPa.Ben-efiting from the strong interfacial bonding,the shear fracture of the joint mainly occurred in the substrate.The results of mi-crostructure characterization showed that the interfacial bonding quality of the SiC joint was high.The structures of the inter-layer under different holding times were similar,and the thickness of the interlayer at each position was uniform.The main phase components of the joint were Ti3SiC2,TiC,and Ti5Si3.With the increase of the holding time,the detected contents of Ti3SiC2 and Ti5Si3 also increased.关键词
SiC陶瓷/扩散连接/Ti中间层/放电等离子烧结(SPS)/抗剪切强度Key words
diffusion bonded/Ti interlayer/silicon carbide/spark plasma sintering/shear strength分类
化学工程引用本文复制引用
胡伟钦,谢悠,徐芯茹,谭瑞轩,杨腾飞..SPS工艺下Ti中间层连接SiC陶瓷的接头组织与强度研究[J].电焊机,2025,55(4):40-48,9.基金项目
国家重点研发计划(2023YFB3711100) （2023YFB3711100）
国家磁约束核聚变能发展研究专项(2024YFE03150000) （2024YFE03150000）
