电讯技术2025，Vol.65Issue(4)：608-613,6.DOI:10.20079/j.issn.1001-893x.240112005
一种硅基三维异构集成W波段T/R组件的设计
Design of a W-band T/R Module with Silicon-based 3D Heterogeneous Integration Technology
摘要
Abstract
According to the application requirements of W-band millimeter-wave radar,a W-band active phase array tile-type T/R module is designed based on the silicon-based micro-electromechanical system(MEMS)3D heterogeneous integration technology.Several microwave monolithic integrated circuits(MMIC)and the passive structure,such as band-pass filter with substrate integrated waveguide(SIW)are integrated.A radio frequency(RF)through-wall structure composed of co-planar waveguide(CPW)-SIW-CPW is designed,with interconnections realized internally by through silicon via(TSV)technology.The T/R module is finally stacked in an eight-layer silicon-based package with low cost and hermetic by multilayer silicon wafer level bonding technology.The test results show that,in 92～94 GHz,the saturated transmitting power is 9 dBm,the transmit gain of each channel is no less than 27 dB,and the receive gain is no less than 20 dB.The module achieves high performance on the basis of high density integration of 4 channels,and has wide applied foreground.关键词
相控阵雷达/瓦片式T/R组件/W波段/MMIC异构集成/硅基三维封装Key words
phased array/tile-type T/R module/W-band/MMIC heterogeneous integrates/silicon-based 3D package分类
电子信息工程引用本文复制引用
林朋,高艳红,冯文杰..一种硅基三维异构集成W波段T/R组件的设计[J].电讯技术,2025,65(4):608-613,6.基金项目
国家自然科学基金资助项目(62231014) （62231014）
