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有机玻璃表面铜网格透明导电薄膜的制备

董岳 王君平 白金 环瑀淳 陶慧龙 王敏

铜业工程Issue(2):55-62,8.
铜业工程Issue(2):55-62,8.DOI:10.3969/j.issn.1009-3842.2025.02.007

有机玻璃表面铜网格透明导电薄膜的制备

Fabrication of Cu Meshes Based Transparent Conductive Films on Polymethyl Methacrylate

董岳 1王君平 1白金 1环瑀淳 1陶慧龙 1王敏2

作者信息

  • 1. 南京航空航天大学材料科学与技术学院,江苏 南京 210016
  • 2. 南京航空航天大学材料科学与技术学院,江苏 南京 210016||航空航天结构力学及控制全国重点实验室,江苏 南京 210016
  • 折叠

摘要

Abstract

Transparent conductive films are widely used in many fields due to their unique optoelectronic performance and electromag-netic shielding characteristics.In this study,Cu meshes based transparent conductive films were fabricated by electroplating and cast-ing with polymethyl methacrylate using random cracking template.The results show that random crack template with narrow slit width and high crack density can be obtained by changing the size of coating bar.The integrity of the meshes can be adjusted by changing the plating voltage and plating time,and integrated Cu meshes can be obtained at 3 V and 4 V.The sheet resistance of the fabrication of Cu meshes based transparent conductive films are 65.5~166.7 mΩ/sq,the transmittance is 78.5%~85.8%,FOM is 24101 under the opti-mal conditions,and the heating stability is positive under the low-temperature conditions after 10 times of heating cycles,and the aver-age electromagnetic shielding efficiency is 28.69 dB,and the electromagnetic shielding efficiency reaches 99.86%.The fabrication method can obtain low sheet resistance and high transmittance transparent conductive films,which provides a reference for the subse-quent fabrication of high-performance metal meshes based transparent conductive films based on the cracked template method.

关键词

有机玻璃/铜网格透明导电薄膜/光电性能/除霜性能/电磁屏蔽

Key words

polymethyl methacrylate/Cu mesh based transparent conductive film/photoelectrical performance/defrosting performance/electromagnetic shielding

引用本文复制引用

董岳,王君平,白金,环瑀淳,陶慧龙,王敏..有机玻璃表面铜网格透明导电薄膜的制备[J].铜业工程,2025,(2):55-62,8.

基金项目

中央高校基本科研业务费-青年科技创新基金项目(理工军口类)(NT2024015) (理工军口类)

南京航空航天大学科研人才启动基金项目(YAH20033)资助 (YAH20033)

铜业工程

1009-3842

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