新型炭材料（中英文）2025，Vol.40Issue(2)：422-437,16.DOI:10.1016/S1872-5805(25)60964-4
新型高面外热导率的中间相炭微球基热界面材料
Novel thermal interface materials based on mesocarbon microbeads with a high through-plane thermal conductivity
摘要
Abstract
The rapid development of the information era has led to in-creased power consumption,which generates more heat.This requires more efficient thermal management systems,with the most direct ap-proach being the development of su-perior thermal interface materials(TIMs).Mesocarbon microbeads(MCMBs)have several desirable properties for this purpose,includ-ing high thermal conductivity and excellent thermal stability.Although their thermal conductivity(K)may not be exceptional among all carbon materials,their ease of production and low cost make them ideal filler materials for developing a new generation of carbon-based TIMs.We report the fabrication of high-performance TIMs by incorporating MCMBs in a polyimide(PI)framework,producing highly graphitized PI/MCMB(PM)foams and anisotropic polydimethylsiloxane/PM(PDMS/PM)composites with a high thermal conductivity using directional freezing and high-temperature thermal annealing.The resulting materials had a high through-plane(TP)K of 15.926 W·m-1·K-1,4.83 times that of conventional thermally conductive silicone pads and 88.5 times higher than that of pure PDMS.The composites had excellent mechanical properties and thermal stability,meeting the de-mands of modern electronic products for integration,multi-functionality,and miniaturization.关键词
热界面材料/中间相炭微球/面外热导率Key words
Thermal interface material/Mesocarbon microbeads/Through-plane thermal conductivity分类
化学化工引用本文复制引用
孙智鹏,马成,王际童,乔文明,凌立成..新型高面外热导率的中间相炭微球基热界面材料[J].新型炭材料（中英文）,2025,40(2):422-437,16.基金项目
This work is partly supported by the National Natural Science Foundation of China(22178107,U21A2060,22178116 and 21978097). 国家自然科学基金(22178107,U21A2060,22178116,21978097). （22178107,U21A2060,22178116 and 21978097）
