高技术通讯2025，Vol.35Issue(2)：113-123,11.DOI:10.3772/j.issn.1002-0470.2025.02.001
片间互连总线协议层关键技术研究
Research on key technology of inter-chip interconnection protocol layer
摘要
Abstract
With the development of new data centers and high-performance computing applications centered around data analytics,web searching,and virtual reality,the demand for data movement on high-performance computing plat-forms has been continuously increasing.The growth in bandwidth requirements for inter-chip data transfers by data-intensive applications remains unabated,with interconnect buses being perceived as potential sources of system bot-tlenecks.In contrast to traditional approaches of enhancing bandwidth by increasing transmission rates and adding signal counts at the physical layer,optimizing bandwidth utilization through architecture design at the bus protocol layer is also an important approach to increasing overall bandwidth.Compared with the former,the latter does not incur additional cost overheads and offers energy-efficient advantages.This paper proposes three key technologies at the protocol layer,namely,the intra-chip semantic to inter-chip semantic conversion scheme with data-command separation,arbitration algorithm based on the Age strategy,and inter-chip data compression technology.The data-command separation semantic strategy exhibits strong cross-architecture generality and serves as a prerequisite for arbitration and compression.The arbitration and compression technologies at the inter-chip bus protocol layer signif-icantly enhance bus bandwidth utilization through architecture methods.Experimental results obtained on the Syn-opsys Zebu emulation acceleration platform demonstrate that the bus architecture employing the proposed methods achieves bandwidth utilization of 45.8％and 69.7％respectively under conditions of data compression disabled/enabled,reaching the international advanced level.关键词
片间互连/总线协议层/语义转换/仲裁/数据压缩/仿真加速器Key words
inter-chip connection/protocol layer/semantic conversion/arbitration/data compression/emu-lation accelerator引用本文复制引用
邢世远,张见齐,王焕东,吴学智,吴瑞阳..片间互连总线协议层关键技术研究[J].高技术通讯,2025,35(2):113-123,11.基金项目
中国科学院战略性先导科技专项(C类)课题(XDC05020100)资助项目. （C类）
