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Individual and interactive action mechanisms of mechanical,chemical,and electrical factors in Co polishing

Fangjin Xie Min Zhong Wenhu Xu Jianfeng Chen Xiaobing Li Meirong Yi

摩擦（英文）2025，Vol.13Issue(6)：73-88,16.

摩擦（英文）2025，Vol.13Issue(6)：73-88,16.DOI:10.26599/FRICT.2025.9440961

Individual and interactive action mechanisms of mechanical,chemical,and electrical factors in Co polishing

Fangjin Xie ¹Min Zhong ²Wenhu Xu ²Jianfeng Chen ¹Xiaobing Li ¹Meirong Yi²

作者信息

1. Department of Mechanical Engineering,Key Laboratory of Tribology,Nanchang University,Nanchang 330031,China
2. Department of Mechanical Engineering,Key Laboratory of Tribology,Nanchang University,Nanchang 330031,China||Jiangxi Province Key Laboratory of Light Alloy,Nanchang University,Nanchang 330031,China
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摘要

关键词

Co/interconnect metal/electrochemical mechanical polishing(ECMP)/polishing factor

Key words

Co/interconnect metal/electrochemical mechanical polishing(ECMP)/polishing factor

引用本文复制引用

Fangjin Xie,Min Zhong,Wenhu Xu,Jianfeng Chen,Xiaobing Li,Meirong Yi..Individual and interactive action mechanisms of mechanical,chemical,and electrical factors in Co polishing[J].摩擦（英文）,2025,13(6):73-88,16.

基金项目

This work was supported by the National Natural Science Foundation of China(Nos.52165025 and 51865030)and the Jiangxi Province Key Laboratory of Light Alloy(No.2024SSY05031). （Nos.52165025 and 51865030）

摩擦（英文）

ISSN：2223-7690

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