铸造技术2025，Vol.46Issue(4)：325-342,18.DOI:10.16410/j.issn1000-8365.2025.5038
烧结助剂对Si3N4陶瓷导热和力学性能影响研究进展
Research Progress on the Effect of Sintering Additives on the Thermal Conductivity and Mechanical Properties of Si3N4 Ceramics
摘要
Abstract
The ongoing evolution of power semiconductor devices toward higher power density,increased switching frequencies,and enhanced integration has introduced critical thermal management challenges,severely compromising their operational stability and long-term reliability.Silicon nitride(Si3N4)ceramics,which are distinguished by exceptional thermal conductivity,superior mechanical performance,and a coefficient of thermal expansion(CTE)that is compatible with third-generation semiconductors,have emerged as ideal candidates for high-performance ceramic substrates.The composition and corresponding ratios of sintering additives strongly affect both the sintering process and final properties,making the selection of optimal additives a difficult challenge in realizing Si3N4 ceramics with excellent heat conduction and robust mechanical reliability.This review systematically summarizes the current research progress in oxide and nonoxide sintering additive systems for the comprehensive fabrication of high-performance Si3N4 ceramics and analyses the mechanisms by which various additive systems tailor the densification process,microstructure evolution,thermal conductivity and mechanical properties.Moreover,it forecasts future development trends and research directions for sintering aid systems for Si3N4 ceramics with high thermal conductivity and high strength.关键词
氮化硅/烧结助剂/热导率/力学性能/烧结Key words
silicon nitride/sintering aid/thermal conductivity/mechanical properties/sintering分类
金属材料引用本文复制引用
邓康,胡加斌,胡得胜,魏智磊,史忠旗..烧结助剂对Si3N4陶瓷导热和力学性能影响研究进展[J].铸造技术,2025,46(4):325-342,18.基金项目
国家自然科学基金(52302069) （52302069）
陕西省自然科学基础研究计划(2023-JC-JQ-29) （2023-JC-JQ-29）
