制冷学报2025，Vol.46Issue(2)：17-27,11.DOI:10.12465/j.issn.0253-4339.2025.02.017
基于多孔结构的微通道散热技术研究现状
Research Status of Microchannel Heat Dissipation Technology Based on Porous Structure
摘要
Abstract
The rapid development of microelectronic devices has driven a trend toward miniaturized and lightweight electronic devices with high heat flux.Porous structures are increasingly used in heat dissipation due to their ability to expand the heat transfer area,enhance nucleation sites for boiling,and regulate surface wettability,significantly improving boiling heat transfer.Microchannel heat dissipation technology based on porous structures has emerged as an effective and promising method to enhance heat sink performance.Recent advancements highlight three common configurations:porous structures on microchannel surfaces,porous materials within microchannels,and porous microchannel skeletons.These structures encompass coatings,microcavities,metal foams,porous fins,and ribs.This article reviews progress in microchannel heat dissipation using porous structures,evaluates the benefits and drawbacks of these configurations,addresses challenges such as balancing heat transfer and pressure drop,and proposes optimization strategies to overcome these issues.关键词
微通道散热器/多孔结构/传热强化/压降/优化设计Key words
microchannel heat sink/porous structure/heat transfer enhancement/pressure drop/optimal design分类
通用工业技术引用本文复制引用
周雄,张莉..基于多孔结构的微通道散热技术研究现状[J].制冷学报,2025,46(2):17-27,11.基金项目
国家自然科学基金(51776074)资助项目.(The project was supported by the National Natural Science Foundation of China(No.51776074).) （51776074）
