集成技术2025，Vol.14Issue(3)：1-23,23.DOI:10.12146/j.issn.2095-3135.20240914001
基于芯粒架构的通信拓扑结构研究:进展与挑战
Research on Communication Topologies for Chiplet Architecture:Progress and Challenges
摘要
Abstract
Chiplet-based multi-chip integration designs provide a flexible and scalable solution that surpasses traditional system on chip monolithic integration.However,inter-Chiplet communication has become a significant bottleneck affecting overall system performance.The network on interposer plays a pivotal role in multi-chip systems,directly influencing both performance and development costs.This paper reviews the communication topologies of Chiplet-based network on interposer structures and delves into the design and implementation methods of current inter-Chiplet communication architectures.It comprehensively covers the communication process from protocol,interface,to application layers,classifying interconnect topologies based on structural configurations,and providing in-depth analyses and cross-comparisons for each category.Additionally,this paper explores the future directions of inter-Chiplet communication technologies,emphasizing technical challenges and potential solutions,and highlights the importance of workload-oriented,reusable interposer layers and topology design.This review aims to provide researchers with a comprehensive overview of the current state of network on interposer technology while simultaneously forecasting its development trends in future multi-chip integrated systems,offering systematic insights to advance frontier research in semiconductor technologies.关键词
芯粒/拓扑/硅中介层/中介层上网络/片上网络Key words
Chiplet/topology/silicon interposer/network on interposer/network on chip分类
信息技术与安全科学引用本文复制引用
张佳帅,杨柳青,付琦麟,程慧武,邵翠萍,李慧云..基于芯粒架构的通信拓扑结构研究:进展与挑战[J].集成技术,2025,14(3):1-23,23.基金项目
国家自然科学基金重大项目(92473112) This work is supported by Major Program of National Natural Science Foundation of China(92473112) （92473112）
