首页|期刊导航|纳米技术与精密工程（英文）|Simulated and experimental study of the chip deformation mechanisms of monocrystalline Cu

Simulated and experimental study of the chip deformation mechanisms of monocrystalline Cu

Bing Liu Kai Jiang Yuxiang Chen Haijie Yang Yurong Wang Keyu Sun Haiyang Li

纳米技术与精密工程（英文）2025，Vol.8Issue(1)：68-78,11.

纳米技术与精密工程（英文）2025，Vol.8Issue(1)：68-78,11.DOI:10.1063/10.0028756

Simulated and experimental study of the chip deformation mechanisms of monocrystalline Cu

Bing Liu ¹Kai Jiang ¹Yuxiang Chen ²Haijie Yang ³Yurong Wang ¹Keyu Sun ¹Haiyang Li¹

作者信息

1. School of Mechanical Engineering,Tianjin University of Commerce,Tianjin 300134,China
2. Swanson School of Engineering,University of Pittsburgh,Pittsburgh,Pennsylvania 15260,USA
3. Semiconductor Manufacturing International(Tianjin)Corporation,Tianjin 300385,China
折叠

摘要

关键词

Monocrystalline Cu/Nanocutting/Chip deformation coefficient/Cutting force/Minimum cutting thickness

Key words

Monocrystalline Cu/Nanocutting/Chip deformation coefficient/Cutting force/Minimum cutting thickness

引用本文复制引用

Bing Liu,Kai Jiang,Yuxiang Chen,Haijie Yang,Yurong Wang,Keyu Sun,Haiyang Li..Simulated and experimental study of the chip deformation mechanisms of monocrystalline Cu[J].纳米技术与精密工程（英文）,2025,8(1):68-78,11.

基金项目

The authors would like to express their appreciation for the support of the National Natural Science Foundation of China(Grant No.51805371)and the Innovation and Entrepreneurship Training Program of Tianjin University of Commerce(Grant No.202310069067).The authors thank the MNMT lab of Tianjin University for the support with the experimental instruments. （Grant No.51805371）

纳米技术与精密工程（英文）

ISSN：1672-6030

访问量0

下载量0

段落导航