真空电子技术Issue(2)：17-20,4.DOI:10.16540/j.cnki.cn11-2485/tn.2025.02.04
基于有限元分析法的陶瓷-金属封接结构改进
Structure Improvement of Ceramic-Metal Sealing Based on Finite Element Analysis
徐玉茹 1苏旭红 1黄仁华 1于志强1
作者信息
- 1. 北京真空电子技术研究所,北京 100015
- 折叠
摘要
Abstract
The stress of ceramic-metal sealing is simulated and analyzed based on finite element analysis method.The results show that the maximum stress on ceramics can be reduced by 35.8％by changing direct sealing structure to flexible sealing structure and by reducing the wall thickness of metal parts in the welding zone.After three times of thermal cycle test,the ceramic-metal sealing can still maintain good gas tightness,and the leakage rate is≤1 ×10-9Pa·m3·s-1.关键词
封接应力/有限元分析/陶瓷-金属封接Key words
Stress of sealing/Finite element analysis/Ceramic-metal sealing分类
电子信息工程引用本文复制引用
徐玉茹,苏旭红,黄仁华,于志强..基于有限元分析法的陶瓷-金属封接结构改进[J].真空电子技术,2025,(2):17-20,4.
