真空电子技术Issue(2)：47-52,6.DOI:10.16540/j.cnki.cn11-2485/tn.2025.02.10
不同焊料封接陶瓷/金属的强度对比和界面微观分析
Sealing Strength Comparison and Interface Microscopic Analysis of Ceramic/Metal Sealing with Different Solders
苏旭红 1徐玉茹 1尚阿曼 1黄亦工 1于志强1
作者信息
- 1. 北京真空电子技术研究所,北京 100015
- 折叠
摘要
Abstract
The sealing strengths of ceramics and different metals(Kovar and oxygen-free copper)welded with different solders are compared.The microstructure and composition of the sealing interface are analyzed by scanning electron microscopy(SEM),and the stress distribution is analyzed by ANSYS simulation.The result shows that the tensile strength of ceramic and the two metals sealed with AuNi 17.5 solder is lower than 90 MPa,and the fracture mode is Mo-Mo delamination.The sealing strength of ceramic/oxygen-free copper is 10％～20％higher than that of ceramic/Kovar when using same solders(excepting AuNi 17.5).Through stress simu-lation,it is found that the intrinsic mechanical properties of materials affects the distribution of sealing stress,and then determines the sealing strength.关键词
陶瓷-金属封接/抗拉强度/焊料选择/界面应力/有限元仿真Key words
Ceramic/metal sealing/Sealing strength/Solder/Interface stress/Finite element simulation分类
电子信息工程引用本文复制引用
苏旭红,徐玉茹,尚阿曼,黄亦工,于志强..不同焊料封接陶瓷/金属的强度对比和界面微观分析[J].真空电子技术,2025,(2):47-52,6.
