表面技术2025，Vol.54Issue(10)：208-224,17.DOI:10.16490/j.cnki.issn.1001-3660.2025.10.017
Cu/diamond复合材料平面研磨实验研究
Experimental Study of Surface Lapping of Cu/diamond Composites
摘要
Abstract
As a new type of electronic packaging material,Cu/diamond composites have excellent characteristics such as high thermal conductivity and low thermal expansion coefficient,and are becoming an important packaging material for high-performance electronic systems.However,electronic packaging materials have extremely strict requirements for surface flatness and dimensional accuracy.In order to achieve efficient and flat lapping process of Cu/diamond composite surface and meet the application requirements of the material,a theoretical and experimental basis is provided.In this paper,a plane lapping test of Cu/diamond composites is carried out with a cast iron lapping disc and diamond powder,and the influence of lapping disc rotating speed,lapping pressure and diamond abrasive grain size on the lapping surface quality and the material removal rate is studied.A precision electronic balance and a digital micrometer are used to measure and calculate the material removal rate.When evaluating the lapping surface quality,the two key indicators of surface roughness and surface morphology are comprehensively considered.The experimental results show that the removal forms of diamond-reinforced particles during the lapping process of Cu/diamond composites mainly include ductile removal,local crushing,overall shedding,and micro-brittle crushing on the surface and edge.There is a step phenomenon between the two phases of the diamond-reinforced particles and the Cu matrix on the lapping surface,which is because the lapping of diamond abrasive particles on the surface of the workpiece is uniform.The diamond-reinforced particles are removed by lapping under the action of high-frequency marking of diamond abrasive grains,and the thickness of the removal is shallow.Copper substrates are easier to remove than diamond-reinforced particles.Therefore,the lapping plane of diamond-reinforced particles is used as the supporting surface to form a cutting step lapping surface on the copper matrix.Moreover,the step becomes more obvious with the increase of diamond abrasive grain size.The lapping surface of diamond-reinforced particles generally shows good flatness,and the Cu matrix area between reinforced particles is relatively flat,so the machining quality is good.In the lapping process of Cu/diamond composites,with the increase of lapping disc speed and lapping pressure,the material removal rate shows a trend of increase first and then decrease,and the material removal rate increases with the increase of the abrasive particle size.In addition,the rotating speed of the lapping disc has little influence on the surface roughness,and the lapping pressure has more influence on the surface quality than the rotating speed of the lapping disc.The abrasive grain size has the most significant influence on the surface quality and the material removal rate.The smaller the abrasive grain size is,the better the surface quality is,but the lapping efficiency is low.Comprehensive lapping processing effect:when the lapping time is 120 min,the lapping disc speed is 180 r/min,the lapping pressure is 1.2 MPa,the diamond abrasive grain size is W14,a relatively flat surface is obtained,the surface roughness is 0.488 μm,and the material removal rate is 0.785 μm/min.It can be seen that the lapping efficiency can be significantly improved and a relatively flat lapping surface can be obtained by reasonably selecting the rotating speed of the lapping disc,lapping pressure and diamond abrasive particle size,which lays a solid foundation for the subsequent application of Cu/diamond composites.关键词
Cu/diamond复合材料/平面研磨/材料去除率/表面粗糙度/表面形貌/研磨参数Key words
Cu/diamond composites/flat lapping/material removal rate/surface roughness/surface morphology/lapping parameters分类
矿业与冶金引用本文复制引用
赵翠翠,刘成炜,于晓琳,焦可如,黄树涛..Cu/diamond复合材料平面研磨实验研究[J].表面技术,2025,54(10):208-224,17.基金项目
中央引导地方科技发展资金(自由探索类基础研究)资助(2023JH6/100100045)Central Government Guiding Local Science and Technology Development Fund(Free Exploration Basic Research)(2023JH6/100100045) （自由探索类基础研究）
