电子器件2025，Vol.48Issue(2)：263-269,7.DOI:10.3969/j.issn.1005-9490.2025.02.005
超高速信号传输完整性的PCB优化设计
PCB Optimization Design for Ultra-High Speed Signal Transmission Integrity
杨建楠 1焦新泉 1李辉景 1杨志文1
作者信息
- 1. 中北大学电子测试技术国家重点实验室,山西 太原 030051||中北大学仪器科学与动态测试教育部重点实验室,山西 太原 030051
- 折叠
摘要
Abstract
The factors affecting PCB transmission integrity are analyzed based on the characteristics of high frequency signal in high speed data acquisition board.Targeting at the reflection,crosstalk and electromagnetic interference during high frequency signal trans-mission,the transmission integrity is optimized from the aspects of mylti-layer PCB board laminated design,impedance matching,wiring design,filter capacitor and power integrity.Simulation analysis of signal reflection and crosstalk after PCB design is completed,the ex-periment result shows that the proposed design can meet the needs of signal integrity optimization.The validity of the design is verified by connecting the board to the power supply.关键词
传输完整性/高频信号测试/PCB设计/阻抗匹配/电源完整性/反射与串扰Key words
transmission integrity/high-frequency signal test/PCB design/impedance matching/power integrity/reflection and crosstalk分类
信息技术与安全科学引用本文复制引用
杨建楠,焦新泉,李辉景,杨志文..超高速信号传输完整性的PCB优化设计[J].电子器件,2025,48(2):263-269,7.
