华侨大学学报（自然科学版）2025，Vol.46Issue(3)：272-282,11.DOI:10.11830/ISSN.1000-5013.202501032
温度作用下高精电子厂房开洞华夫板的力学性能分析
Mechanical Performance Analysis of Perforated Waffle Plate in High-Precision Electronic Factory Building Under Temperature Effect
摘要
Abstract
In order to analyze the stress and crack response of the floor under temperature influence in perfo-rated waffle plate without expansion joints,the ABAQUS finite element analysis software is used to simulate the perforated waffle plate,comparing with the engineering practice,the stress and deformation of this kind of floor under different sizes and temperature variations are obtained.The results show that under the daily tem-perature variation,the floor in the core area does not exceed the calculation stress limit,and the maximum dis-placement and stress concentration mainly appear at the slab-column joints.With the increase of concrete strength,the overall stress has no obvious change under the same temperature difference,and the increment is less than 2％,but the increase of floor thickness leads to the sudden change of stress and the change of de-formation trend.Considering the block construction of the reinforced concrete floor with large span,the rea-sonable control of the temperature difference between plates within 15-30 ℃ is beneficial to the uniform stress distribution in the floor after monolithic pouring.关键词
温度作用/开洞华夫板/有限元模拟/超长混凝土Key words
temperature effect/perforated waffle plate/finite element simulation/super-long concrete分类
土木建筑引用本文复制引用
杨超祺,陈连健,方四宝,向勇,李海锋..温度作用下高精电子厂房开洞华夫板的力学性能分析[J].华侨大学学报（自然科学版）,2025,46(3):272-282,11.基金项目
福建省科技计划项目对外合作项目(2024I0015) （2024I0015）
